Hypertec PA3108U-1M51-HY (Legacy) memory module 0.5 GB 1 x 0.5 GB SDR SDRAM 133 MHz DDR3 2 V Design Cooling type

2 V Design Cooling type Heatsink Technical details Cooling type Heatsink Memory Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC Memory form factor 288-pin DIMM CAS latency 21 Memory voltage 1

2 V Design Backlight No Technical details Chips organisation 2Rx4 Memory Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for Server Memory form factor 288-pin DIMM CAS latency 15 Memory voltage 1

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 260-pin SO-DIMM Memory clock speed 2400 MHz Internal memory type DDR4 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 260-pin SO-DIMM Memory clock speed 2400 MHz Internal memory type DDR4

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 4 GB Internal memory 4 GB Memory form factor 240-pin DIMM ECC No Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 4 GB Internal memory 4 GB Memory form factor 240-pin DIMM ECC No Memory clock speed 1333 MHz Internal memory type DDR3

making memory upgrades straightforward for both beginners and experienced users

Hypertec PA3108U-1M51-HY (Legacy) memory module 0.5 GB 1 x 0.5 GB SDR SDRAM 133 MHz DDR3 2 V Design Cooling typeA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to