Hypertec HYMAS73256 (Legacy) memory module 0.25 GB 1 x 0.25 GB DDR 400 MHz DDR4 2 V Design Backlight No

2 V Design Backlight No Technical details Chips organisation 1Rx8 Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 260-pin SO-DIMM CAS latency 19 Memory voltage 1

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3

Memory Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1866 MHz Internal memory type DDR3 Features Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1866 MHz Internal memory type DDR3

A reliable

Memory Memory layout (modules x size) 1 x 4 GB Internal memory 4 GB Component for Laptop Memory form factor 204-pin SO-DIMM Memory clock speed 1600 MHz Internal memory type DDR3 Features Memory layout (modules x size) 1 x 4 GB Internal memory 4 GB Component for Laptop Memory form factor 204-pin SO-DIMM Memory clock speed 1600 MHz Internal memory type DDR3

Hypertec HYMAS73256 (Legacy) memory module 0.25 GB 1 x 0.25 GB DDR 400 MHz DDR4 2 V Design Backlight NoA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to