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supporting industries such as semiconductors
horizontal
this blade ensures rapid material removal with minimal chipping — making it ideal for rough slabbing
and tile cutting applications
each wheel comes with a 1" arbor hole and a set of bushings (1/2"
12" Grooved Polyurethane Cerium Oxide Polishing Pad – Glass & Mirror Finishing Buffing Wheel Backing:None supporting industries such as semiconductorsThe LP 66 polyurethane cerium oxide polishing pads are engineered for professionals in lapidary optics, semiconductor, and glass manufacturing who demand uncompromising performance and sub micron precision. Constructed from hydrophobic polyurethane and infused with cerium oxide, the LP 66 Pad delivers rapid material removal while maintaining ultra low friction and heatideal for polishing heat sensitive materials like optical lenses, LCD substrates,
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